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*Faturas totais de silício de grau eletrônico-exclui bolachas não polidas e recuperadas;
As remessas são apenas para aplicações de semicondutores e não incluem aplicações solares
硅晶圆是大多数半导体的基本材料 ， 是所有电子产品的重要部件。高度工程化的晶圆片直径可达12英寸 ， 可用作制造大多数半导体器件的衬底材料。
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